JPH0328784U - - Google Patents
Info
- Publication number
- JPH0328784U JPH0328784U JP8915689U JP8915689U JPH0328784U JP H0328784 U JPH0328784 U JP H0328784U JP 8915689 U JP8915689 U JP 8915689U JP 8915689 U JP8915689 U JP 8915689U JP H0328784 U JPH0328784 U JP H0328784U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- lead wire
- fixing structure
- channel pattern
- wire fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8915689U JPH0328784U (en]) | 1989-07-31 | 1989-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8915689U JPH0328784U (en]) | 1989-07-31 | 1989-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0328784U true JPH0328784U (en]) | 1991-03-22 |
Family
ID=31638751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8915689U Pending JPH0328784U (en]) | 1989-07-31 | 1989-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328784U (en]) |
-
1989
- 1989-07-31 JP JP8915689U patent/JPH0328784U/ja active Pending
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